Lefapheng la tlhahiso ea li-semiconductor, mokhoa oa khale oa tlhahiso ea matsete a maholo, a phahameng, o tobane le phetoho e ka bang teng. Ka pontšo e tlang ea "CEATEC 2024", Minimum Wafer Fab Promotion Organisation e bonts'a mokhoa o mocha oa tlhahiso ea semiconductor o sebelisang lisebelisoa tsa ho etsa li-semiconductor tse nyane haholo bakeng sa lits'ebetso tsa lithography. Boqapi bona bo tlisa menyetla eo ho seng mohla e kileng ea e-ba teng bakeng sa likhoebo tse nyane le tse mahareng (li-SME) le tse qalang. Sengoliloeng sena se tla kopanya tlhaiso-leseling e nepahetseng ho lekola semelo, melemo, liphephetso, le tšusumetso e ka bang teng ea thekenoloji e nyane ea wafer fab indastering ea semiconductor.
Ho etsa li-semiconductor ke indasteri e matla haholo ea chelete le theknoloji. Ka tloaelo, tlhahiso ea semiconductor e hloka lifeme tse kholo le likamore tse hloekileng ho hlahisa liphaephe tse 12-inch. Matsete a lichelete bakeng sa lesela le leng le le leng le leholo la wafer hangata a fihla ho li-yen tse libilione tse 2 (hoo e ka bang limilione tse likete tse 120 tsa RMB), e leng se etsang hore ho be thata ho li-SME le ba qalang ho kena tšimong ena. Leha ho le joalo, ka ho hlaha ha thekenoloji e fokolang ea wafer fab, boemo bona boa fetoha.
Masela a fokolang a li-wafer ke litsamaiso tse ncha tsa tlhahiso ea li-semiconductor tse sebelisang li-wafers tsa 0.5-inch, tse fokotsang haholo sekhahla sa tlhahiso le matsete a lichelete ha li bapisoa le li-wafers tse tloaelehileng tsa 12-inch. Matsete a lichelete bakeng sa thepa ena ea tlhahiso e ka ba li-yen tse limilione tse 500 feela (hoo e ka bang limilione tse 23.8 tsa RMB), e nolofalletsang li-SME le li-startups ho qala tlhahiso ea li-semiconductor ka matsete a tlaase.
Tšimoloho ea theknoloji ea "miniconductor" ea "miniconductor" e ka saloa morao ho tloha morerong oa lipatlisiso o qalileng ke Setsi sa Naha sa Saense e Phahameng ea Liindasteri le Theknoloji (AIST) Japane ka 2008. , tlhahiso ea lihlopha tse nyenyane. Boiteko bona, bo etelletsoeng pele ke Lekala la Moruo, Khoebo le Liindasteri la Japane, bo kenyelelitse tšebelisano-mmoho har'a lik'hamphani le mekhatlo ea Majapane ea 140 ho theha moloko o mocha oa litsamaiso tsa tlhahiso, ka sepheo sa ho fokotsa haholo litšenyehelo le litšitiso tsa tekheniki, ho lumella baetsi ba likoloi le lisebelisoa tsa lapeng ho hlahisa li-semiconductors. le lisensara tseo ba li hlokang.
**Melemo ea Minimum Wafer Fab Technology:**
1. **Matsete a Motse a Fokotsoeng Haholo:** Liaparo tsa khale tsa li-wafer li hloka matsete a chelete a fetang li-yen tse libilione, ha sepheo sa matsete bakeng sa li-wafer fabs e le 1/100 ho isa ho 1/1000 feela ea chelete eo. Kaha sesebelisoa se seng le se seng se senyenyane, ha ho hlokahale libaka tse kholo tsa fektheri kapa li-photomasks bakeng sa ho thehoa ha potoloho, ho fokotsa haholo litšenyehelo tsa ts'ebetso.
2. **Mehlala ea Tlhahiso e Fetohang le e sa Tšoaneng:** Masela a fokolang a liphaephe a shebana le ho hlahisa mefuta e fapaneng ea lihlahisoa tse nyane. Moetso ona oa tlhahiso o lumella li-SME le li-startups ho itloaetsa le ho hlahisa kapele ho latela litlhoko tsa bona, ho fihlela tlhoko ea 'maraka bakeng sa lihlahisoa tse ikhethileng le tse fapaneng tsa semiconductor.
3. **Mekhoa e Nolofalitsoeng ea Tlhahiso:** Thepa ea ho etsa lintho ka har'a li-wafer fabs e na le sebopeho le boholo bo lekanang bakeng sa lits'ebetso tsohle, 'me lijana tsa lipalangoang tsa liphaephe (li-shuttle) li fumaneha hohle bakeng sa mohato ka mong. Kaha lisebelisoa le li-shuttle li sebetsa sebakeng se hloekileng, ha ho hlokahale ho boloka likamore tse kholo li hloekile. Moralo ona o fokotsa haholo litšenyehelo tsa tlhahiso le ho rarahana ka theknoloji e hloekileng ea lehae le mekhoa e nolofalitsoeng ea tlhahiso.
4. **Tlhahiso e Tlase ea Motlakase le Tšebeliso ea Motlakase ka Lapeng:** Thepa ea ho etsa thepa ka har'a masela a liphaephe e boetse e na le tšebeliso e tlase ea matla 'me e ka sebetsa ka matla a tloaelehileng a lelapa a AC100V. Tšobotsi ena e lumella lisebelisoa tsena hore li sebelisoe libakeng tse ka ntle ho likamore tse hloekileng, ho fokotsa tšebeliso ea matla le litšenyehelo tsa ts'ebetso.
5. **Shortened Manufacturing Cycles:** Ho etsoa ha li-semiconductor tse kholo hangata ho hloka nako e telele ea ho leta ho tloha ho odara ho isa thomelong, athe masela a fokolang a kaka fumana tlhahiso ea nako ea bongata bo hlokahalang ba li-semiconductors ka nako e batloang. Monyetla ona o bonahala ka ho khetheha masimong a kang Internet of Things (IoT), e hlokang lihlahisoa tse nyenyane, tse phahameng tsa semiconductor.
**Pontšo le Tšebeliso ea Theknoloji:**
Pontšong ea "CEATEC 2024", Mokhatlo oa Minimum Wafer Fab Promotion Organisation o bonts'itse ts'ebetso ea lithography e sebelisa lisebelisoa tsa tlhahiso ea li-semiconductor tse nyane haholo. Nakong ea pontšo, ho ile ha hlophisoa mechine e meraro ho bontša mokhoa oa lithography, o neng o kenyelletsa ho roala ho hanyetsa, ho pepeseha le tsoelo-pele. Setshelo sa lipalangoang (shuttle) se ne se tšoeroe ka letsoho, se behoa ka har'a thepa, 'me se butsoe ka ho tobetsa konopo. Ka mor'a ho phethoa, shuttle e ile ea nkoa 'me ea behoa mochine o latelang. Boemo ba ka hare le tsoelo-pele ea sesebelisoa ka seng li ne li bontšoa ho li-monitor tsa tsona.
Hang ha mekhoa ena e meraro e phethiloe, sephaphatha se ile sa hlahlojoa ka tlas'a microscope, se senola paterone e nang le mantsoe a reng "Happy Halloween" le papiso ea mokopu. Pontšo ena ha ea ka ea bontša feela bokhoni ba theknoloji ea minimal wafer fab empa hape e totobalitse ho fetoha ha eona le ho nepahala ho holimo.
Ho feta moo, lik'hamphani tse ling li se li qalile ho etsa liteko ka theknoloji ea minimal wafer fab. Mohlala, Yokogawa Solutions, e leng setsi sa Yokogawa Electric Corporation, e phatlalalitse mechini e ntlafalitsoeng le e khahlisang ka bokhabane, e batlang e lekana le mochini o rekisang lino, o mong le o mong o na le mesebetsi ea ho hloekisa, ho futhumatsa le ho pepesa. Mechini ena e sebetsa hantle ho theha mohala oa tlhahiso ea semiconductor, 'me bonyane sebaka se hlokahalang bakeng sa mohala oa tlhahiso ea "mini wafer fab" ke boholo ba makhotla a mabeli a tennis, ke 1% feela ea sebaka sa lesela la 12-inch.
Leha ho le joalo, masela a fokolang a li-wafer hajoale a sokola ho qothisana lehlokoa le lifeme tse kholo tsa semiconductor. Meralo ea potoloho e ntle haholo, haholo-holo ho theknoloji e tsoetseng pele ea ts'ebetso (e kang 7nm le ka tlase), e ntse e itšetlehile ka lisebelisoa tse tsoetseng pele le bokhoni bo boholo ba tlhahiso. Mekhoa ea li-wafer ea 0.5-inch ea masela a fokolang a li-wafer a loketse ho etsa lisebelisoa tse bonolo, tse kang li-sensor le MEMS.
Masela a fokolang a li-wafer a emela mofuta o mocha o tšepisang haholo bakeng sa tlhahiso ea semiconductor. E khetholloa ka miniaturization, litšenyehelo tse tlase, le ho feto-fetoha ha maemo, li lebelletsoe ho fana ka menyetla e mecha ea mmaraka bakeng sa li-SME le lik'hamphani tse ncha. Melemo ea masela a fokolang a li-wafer a bonahala haholo libakeng tse ikhethileng tsa ts'ebeliso joalo ka IoT, li-sensor le MEMS.
Nakong e tlang, ha theknoloji e ntse e hola le ho khothaletsoa ho ea pele, masela a tlase a ka fetoha matla a bohlokoa indastering ea tlhahiso ea li-semiconductor. Ha ba fe likhoebo tse nyane feela menyetla ea ho kena lebaleng lena empa hape li ka tsamaisa liphetoho sebopehong sa litšenyehelo le mefuta ea tlhahiso ea indasteri eohle. Ho fihlela sepheo sena ho tla hloka boiteko bo bongata ho thekenoloji, nts'etsopele ea litalenta le kaho ea tikoloho.
Ha nako e ntse e ea, kholiso e atlehileng ea masela a fokolang a liphaephe e ka ba le phello e tebileng indastering eohle ea li-semiconductor, haholo-holo mabapi le phapano ea phepelo ea thepa, ho fetoha ha maemo a tlhahiso, le taolo ea litšenyehelo. Tšebeliso e pharalletseng ea theknoloji ena e tla thusa ho ntšetsa pele boqapi le tsoelo-pele indastering ea lefatše ea semiconductor.
Nako ea poso: Oct-25-2024