Ho Hola ha Matsete a AI: Thekiso ea Lisebelisoa tsa Tlhahiso ea Semiconductor (Chip) ea Lefatše ka Bophara e Lebeletsoe ho Fihla Holimo ka Rekoto ka 2025.
Ka matsete a matla bohlaleng ba maiketsetso, thekiso ea lisebelisoa tsa tlhahiso ea semiconductor (chip) lefatšeng ka bophara e lebelletsoe ho fihla sehlohlolong sa rekoto ka 2025. Ho lebelletsoe hore thekiso e tla tsoela pele ho hola le ho beha lirekoto tse ncha lilemong tse peli tse tlang (2026-2027).
Ka la 16 Tšitoe, Semiconductor Equipment and Materials International (SEMI) e lokollotse tlaleho ea eona ea 'maraka oa lefats'e oa lisebelisoa tsa chip ho SEMICON Japan 2025. Tlaleho e bolela esale pele hore qetellong ea 2025, thekiso ea lisebelisoa tsa chip lefatšeng ka bophara (lihlahisoa tse ncha) e tla eketseha ka 13.7% selemo le selemo, e fihle holimo rekotong ea US $ 133 bilione. Ho feta moo, thekiso e lebelletsoe ho tsoela pele ho hola lilemong tse peli tse tlang, e fihle ho US $ 145 bilione ka 2026 le US $ 156 bilione ka 2027, e ntse e roba lirekoto tsa nalane khafetsa.
SEMI e totobatsa hore sesosa se seholo sa kholo e tsoelang pele thekisong ea lisebelisoa tsa chip se tsoa matseteng a theknoloji e tsoetseng pele ea logic, memori le liphutheloana tse tsoetseng pele tse amanang le bohlale ba maiketsetso.
CEO oa SEMI Ajit Manocha o itse, "Thekiso ea lefats'e ka bophara ea lisebelisoa tsa chip e matla, 'me lits'ebetso tsa pele le tsa morao li lebelletsoe ho hola selemong sa boraro se latellanang, 'me thekiso e lebelletsoe ho feta $150 bilione ka lekhetlo la pele ka 2027. Kamora tebello ea rona ea bohareng ba selemo e lokollotsoeng ka Phupu, re phahamisitse tebello ea rona ea thekiso ea lisebelisoa tsa chip ka lebaka la matsete a mafolofolo ho feta a neng a lebelletsoe ho tšehetsa tlhoko ea AI."
SEMI e rera thekiso ea lisebelisoa tsa tlhahiso ea lihlahisoa tsa lefats'e (lisebelisoa tsa tlhahiso ea wafer; WFE) ho hola ka 11.0% selemo ho ea ho $115.7 bilione ka 2025, ho tloha ponelopeleng ea bohareng ba selemo ea $110.8 bilione le ho feta ponelopele ea 2024 ea $104 bilione, e beha rekoto e ncha. Phetoho e ntseng e eketseha ea ponelopele ea thekiso ea WFE e bonts'a haholo-holo keketseho e sa lebelloang ea matsete a DRAM le HBM a susumetsoang ke tlhoko ea k'homphieutha ea AI, hammoho le monehelo o moholo o tsoang katolosong e tsoelang pele ea bokhoni ba Chaena. Ka lebaka la tlhoko e ntseng e hola ea logic e tsoetseng pele le memori, thekiso ea lefats'e ea WFE e lebelletsoe ho hola ka 9.0% ka 2026 le ho eketseha ka 7.3% ka 2027, ho fihla ho $135.2 bilione.
SEMI e bontša hore Chaena, Taiwan le Korea Boroa li lebelletsoe ho lula e le bareki ba bararo ba ka sehloohong ba lisebelisoa tsa chip ka 2027. Nakong ea ponelopele (ho fihlela ka 2027), Chaena ho lebelletsoe ho tsoela pele ho tsetela lits'ebetsong tse holileng le li-node tse itseng tse tsoetseng pele ho boloka boemo ba eona bo etellang pele; leha ho le joalo, kholo e lebelletsoe ho lieha ka mor'a 2026, 'me thekiso e fokotseha butle-butle. Taiwan, ho lebeletsoe hore matsete a bohlokoa ho atoloseng bokhoni ba tlhahiso bo tsoetseng pele a tsoele pele ho fihlela ka 2025. Korea Boroa, matsete a maholo mahlaleng a tsoetseng pele a memori, ho kenyeletsoa le HBM, a tla tšehetsa thekiso ea lisebelisoa.
Libakeng tse ling, ho lebeletsoe hore matsete a eketsehe ka 2026 le 2027 ka lebaka la likhothaletso tsa mmuso, boiteko ba ho aha libaka tsa lehae, le bokhoni bo eketsehileng ba tlhahiso bakeng sa lihlahisoa tse ikhethang.
Mokhatlo oa Liindasteri tsa Theknoloji ea Elektroniki le Tlhahisoleseling oa Japane (JEITA) o lokolitse tlaleho ka la 2 Tšitoe o bolela hore, ho ea ka ponelopele ea morao-rao e tsoang ho World Semiconductor Trade System (WSTS), matsete litsing tsa data tsa bohlale ba maiketsetso e tla ba sesosa se seholo, e leng se tla susumetsa kholo e tsoelang pele ea lebelo le phahameng ea tlhoko ea memori, li-GPU le li-chip tse ling tsa logic. Ka hona, thekiso ea li-semiconductor lefatšeng ka bophara e lebelletsoe ho eketseha ka 26.3% selemo le selemo ho fihlela ho $975.46 bilione ka 2026, e atamelang letšoao la $1 trillion le ho tšoaea rekoto e ncha e phahameng bakeng sa selemo sa boraro se latellanang.
Thekiso ea lisebelisoa tsa semiconductor tsa Majapane e ntse e tsoela pele ho fihlela maemo a holimo a macha.
Thekiso ea lisebelisoa tsa tlhahiso ea semiconductor Japane e ntse e le matla, ka Mphalane 2025 thekiso e fetang li-yen tse libilione tse 400 bakeng sa khoeli ea bo-12 e latellanang, e beha rekoto e ncha bakeng sa nako e tšoanang. Ka lebaka la sena, likarolo tsa lik'hamphani tsa lisebelisoa tsa chip tsa Japane li ile tsa phahama kajeno.
Ho ya ka Yahoo Finance, ho tloha ka 9:20 hoseng ka nako ya Taipei ka la 27, diabo tsa Tokyo Electron (TEL) di nyolohile ka 2.60%, diabo tsa Advantest (moetsi wa disebediswa tsa teko) di nyolohile ka 4.34%, mme diabo tsa Kokosai (moetsi wa disebediswa tsa ho boloka difilimi tse tshesane) di nyolohile ka 5.16%.
Lintlha tse lokollotsoeng ke Mokhatlo oa Lisebelisoa tsa Semiconductor oa Japane (SEAJ) ka la 26 li bontšitse hore thekiso ea lisebelisoa tsa semiconductor tsa Japane (ho kenyeletsoa le thepa e romelloang kantle ho naha, karolelano e tsamaeang ea likhoeli tse 3) e fihlile ho li-yen tse libilione tse 413.876 ka Mphalane 2025, keketseho ea 7.3% ha e bapisoa le nako e tšoanang selemong se fetileng, e tšoaeang khoeli ea bo-22 e latellanang ea kholo. Thekiso ea khoeli le khoeli e fetile li-yen tse libilione tse 300 bakeng sa likhoeli tse 24 tse latellanang le li-yen tse libilione tse 400 bakeng sa likhoeli tse 12 tse latellanang, e leng se behang rekoto e ncha bakeng sa khoeli eo.
Thekiso e theohile ka 2.5% ha e bapisoa le khoeli e fetileng (Loetse 2025), e leng se tšoaeang ho theoha ha bobeli likhoeling tse tharo.
Ho tloha ka Pherekhong ho isa Mphalane 2025, thekiso ea lisebelisoa tsa semiconductor Japane e fihlile ho li-yen tse litrillion tse 4.214, e leng keketseho ea 17.5% ha e bapisoa le nako e tšoanang selemong se fetileng, e fetang haholo rekoto ea nalane ea li-yen tse litrillion tse 3.586 tse behiloeng ka 2024.
Karolo ea 'maraka oa lefats'e oa Japane ea lisebelisoa tsa semiconductor (ho latela chelete e kenang thekisong) e fihlile ho 30%, e leng se etsang hore e be 'maraka oa bobeli o moholo ka ho fetisisa lefatšeng ka mor'a United States.
Ka la 31 Mphalane, Tokyo Telecom (TEL) e phatlalalitse liphetho tsa eona tsa lichelete, e bolela hore ka lebaka la ts'ebetso e betere ho feta kamoo ho neng ho lebelletsoe, k'hamphani e phahamisitse sepheo sa eona se kopaneng sa lekeno bakeng sa selemo sa lichelete sa 2025 (Mmesa 2025 ho isa Hlakubele 2026) ho tloha ho ¥2.35 trillion ka Phupu ho isa ho ¥2.38 trillion. Sepheo se kopaneng sa phaello ea ts'ebetso le sona se phahamisitsoe ho tloha ho ¥570 bilione ho isa ho ¥586 bilione, 'me sepheo se kopaneng sa phaello e kopaneng ho tloha ho ¥444 bilione ho isa ho ¥488 bilione.
Ka la 3 Phupu, SEAJ e lokollotse tlaleho ea ponelopele e bontšang hore ka lebaka la tlhoko e matla ea li-GPU le li-HBM ho tsoa ho li-server tsa AI, TSMC ea Taiwan e tsoetseng pele ea semiconductor foundry e tla qala tlhahiso e kholo ea li-chips tsa 2nm, e leng se etsang hore matsete a eketsehe theknolojing ea 2nm. Ho feta moo, matsete a Korea Boroa ho DRAM/HBM le 'ona a ntse a hola. Ka hona, ponelopele ea thekiso ea lisebelisoa tsa semiconductor tsa Japane (ha ho buuoa ka thekiso ea lik'hamphani tsa Japane ka hare ho naha le machabeng) selemong sa lichelete sa 2025 (Mmesa 2025 ho isa Hlakubele 2026) e ntlafalitsoe ho tloha khakanyong ea pele ea li-yen tse libilione tse 4.659 ho ea ho li-yen tse libilione tse 4.8634, keketseho ea 2.0% ha e bapisoa le selemo sa lichelete sa 2024, 'me ho lebelletsoe hore e fihle holimo haholo selemong sa bobeli se latellanang.
Nako ea poso: Tshitwe-22-2025